کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1520979 1511796 2015 9 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Effect of solutionising and ageing on the microstructure and mechanical properties of a high strength die-cast Al–Mg–Zn–Si alloy
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد مواد الکترونیکی، نوری و مغناطیسی
پیش نمایش صفحه اول مقاله
Effect of solutionising and ageing on the microstructure and mechanical properties of a high strength die-cast Al–Mg–Zn–Si alloy
چکیده انگلیسی


• Optimising the solution and ageing process for the die-cast Al–Mg–Zn–Si alloy.
• Dissolution and precipitation of Zn-rich compounds during solution and ageing.
• Significant improvement in strength and ductility by the new Al–Mg–Zn–Si alloy.

Solutionising and ageing heat treatment for a newly developed die-cast Al–Mg–Zn–Si alloy has been carried out in order to investigate the microstructural evolution, the improvement in mechanical properties and the relevant strengthening mechanisms. Based on the results obtained from the treatment at different temperatures and periods of time, the heat treatment was optimised to be at 490 °C for 30 min for the solutionising, and at 180 °C for 60 min for the ageing by considering the improvement of both the strength and ductility. Mg32(Al,Zn)49 intermetallic in the as-cast microstructure was dissolved into the α-Al phase during solutionising and fine precipitates were formed during the subsequent ageing to enhance the mechanical properties of the alloy. After the heat treatment, the samples made by high pressure die-casting exhibited yield strength of 320 MPa, UTS of 420 MPa and elongation of 4.5%, which was a significant improvement in comparison with that under as-cast condition. The improvement of the mechanical properties achieved by the solution and ageing treatment is favourable for the applications where lightweight and high strength are essential for structural thin wall castings.

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ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Chemistry and Physics - Volume 167, 1 November 2015, Pages 88–96
نویسندگان
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