Acrylonitrile-capped poly(propyleneimine) dendrimer curing agent for epoxy resins: Model-free isoconversional curing kinetics, thermal decomposition and mechanical properties

► We compare the isoconversional curing kinetics of DGEBA/1.0GPPI and DGEBA/PAN4. ► Acrylonitrile-capped PAN4 is much lower reactive than controlled 1.0GPPI. ► TG analysis shows the two cured epoxy systems are thermally stable up to 200 °C. ► DMA results reveal the viscoelastic response of the two cured networks differs greatly. ► PAN4 greatly improves the shear, impact strengths and processability of the epoxy.