Synthesis of CuS nanorods grown at room temperature by electrodeposition method

CuS thin films were deposited on stainless steel substrates from an aqueous solution of CuSO4, Na2S2O3 and Triethanolamine. Deposited films were characterized by XRD, SEM, EDAX, Raman and Optical measurements. The electrodeposition bath concentration can be used to control the diameter of the electrodeposited nanorods within the range of 35–40 nm. The formation of complexes of copper ions and TEA was found to be a key factor in the nanorods growth process. Films are polycrystalline with hexagonal crystal structure. SEM images indicate that the film surfaces are smooth, homogeneous and well-covered. A new structure of CuS nanorods having length of 5–10 μm and diameter from 35 to 40 nm has been demonstrated. By changing bath concentration and keeping deposition time fixed the agglomeration of rods is enhanced due to the formation of large number of particles during growth process. Raman shifts of samples are detected at wave numbers 473 cm−1. Typical film deposited with optimized bath concentration shows optical band gap of about 2.73 eV.

The electrodeposition bath concentration can be used to control the diameter of the electrodeposited nanorods to within the range of 35–40 nm. The formation of complexes of copper ions and Triethonolamine was found to be a key factor in the nanorods growth process.Figure optionsDownload as PowerPoint slideHighlights
► Electrodeposited copper sulphide (covellite) thin films.
► X-ray studies shows films are polycrystalline in nature.
► Surface morphology by electrodeposition at room temperature shows nanorods of 35 nm–40 nm in size.
► Dramatic role of complexing agent in formation of CuS nanorods.
► The Optical band gap changes from 2.58 eV to 2.73 eV.