کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1527197 1511851 2008 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Corrosion behaviour assessment of lead-free Sn–Ag–M (M = In, Bi, Cu) solder alloys
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد مواد الکترونیکی، نوری و مغناطیسی
پیش نمایش صفحه اول مقاله
Corrosion behaviour assessment of lead-free Sn–Ag–M (M = In, Bi, Cu) solder alloys
چکیده انگلیسی

The corrosion behaviour of lead-free Sn88.7Ag2.3In9.0, Sn86.6Ag3.0Bi10.4, Sn96.1Ag3.1Cu0.8 and Sn90.4Ag2.9Cu6.7 solder alloys was investigated in 0.1 M NaCl solution and compared with that of the conventional eutectic Sn73.9Pb26.1 solder. Scanning electron microscopy (SEM) and electron probe microanalysis (EPMA) were used to characterize the samples prior and after the electrochemical tests. Potentiodynamic polarization curves show that Sn88.7Ag2.3In9.0 and Sn86.6Ag3.0Bi10.4 solders exhibit poor corrosion behaviour compared to that of Sn73.9Pb26.1. On the contrary, copper addition enhances the corrosion resistance of Sn–Ag solder alloys which exhibit improved passivity behaviour compared to Sn73.9Pb26.1 solder. Moreover, increasing the copper content from 0.8 to 6.7 at% results in a significant improvement of the corrosion behaviour of Sn–Ag solders. The presence of tin oxychlorides were detected at the surface of all the alloys investigated after the electrochemical tests. In addition, indium oxychlorides were also observed in the Sn88.7Ag2.3In9.0 solder alloy.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Chemistry and Physics - Volume 109, Issues 2–3, 15 June 2008, Pages 386–391
نویسندگان
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