Keywords: لحیم کاری بدون سرب; Tin pest; Allotropic transformation; Lead-free solders; RoHS; Reliability; Risk; Solder joints;
مقالات ISI لحیم کاری بدون سرب (ترجمه نشده)
مقالات زیر هنوز به فارسی ترجمه نشده اند.
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در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
Keywords: لحیم کاری بدون سرب; Lead-free solders; Electronics; Reliability; SAC; Alternative solders;
Keywords: لحیم کاری بدون سرب; Lead-free solders; Wave solder dross; Tin oxide
Keywords: لحیم کاری بدون سرب; Lead-free solders; SAC305; Creep; Fatigue; Anand-Model; Coffin–Manson
Keywords: لحیم کاری بدون سرب; Nano-particles; Lead-free solders; Creep; Intermetallic compounds;
Thermodynamic reassessment of the Ni-In system using ab-initio data for end-member compound energies
Keywords: لحیم کاری بدون سرب; Nickel Indium; Ni-In; Lead-free solders; Phase diagram; CALPHAD; Thermodynamic assessment;
A perspective of the IPC report on lead-free electronics in military/aerospace applications
Keywords: لحیم کاری بدون سرب; Lead-free electronics; Lead-free solders; Sn whiskers; Military/aerospace application; RoHS exempt; Reliability risks;
Study of electromigration resistance of (Pd,Ni)Sn4 phase in lead-free solder joints
Keywords: لحیم کاری بدون سرب; Electromigration; Intermetallics; Interface; PdSn4; Lead-free solders;
Solid-state interfacial reactions of Sn and Sn-Ag-Cu solders with an electroless Co(P) layer deposited on a Cu substrate
Keywords: لحیم کاری بدون سرب; Lead-free solders; Electroless deposition; Interfacial reactions; Diffusion barrier;
Investigating the effect of isothermal aging on the morphology and shear strength of Sn-5Sb solder reinforced with carbon nanotubes
Keywords: لحیم کاری بدون سرب; Lead-free solders; Carbon nanotubes; Composite solders; Shear strength;
Influence of the P content on phase formation in the interfacial reactions between Sn and electroless Co(P) metallization on Cu substrate
Keywords: لحیم کاری بدون سرب; Interfacial reactions; Lead-free solders; Co; Electroless plating;
Influence of cerium addition on microstructure and properties of Sn-Cu-(Ag) solder alloys
Keywords: لحیم کاری بدون سرب; Lead-free solders; Rare earth elements; Microanalysis; Mechanical characterization; Strengthening;
Microstructural modifications and properties of low-Ag-content Sn-Ag-Cu solder joints induced by Zn alloying
Keywords: لحیم کاری بدون سرب; Lead-free solders; Microstructure; Mechanical properties;
Formation, processing and characterization of Co-Sn intermetallic compounds for potential integration in 3D interconnects
Keywords: لحیم کاری بدون سرب; 3D interconnects; Metallization and barrier materials; Lead-free solders; Cobalt-Tin (Co-Sn); Cobalt-Tin intermetallics (Co-Sn IMC);
Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products
Keywords: لحیم کاری بدون سرب; Lead-free solders; Microstructure; Mechanical properties
Synthesis and thermal properties of low melting temperature tin/indium (Sn/In) lead-free nanosolders and their melting behavior in a vapor flux
Keywords: لحیم کاری بدون سرب; Lead-free solders; Nanosolders, tin/indium; Low melting temperature; Reflow; Flux;
The effect of undercooling on the microstructure and tensile properties of hypoeutectic Sn–6.5Zn–xCu Pb-free solders
Keywords: لحیم کاری بدون سرب; Lead-free solders; Hypoeutectic Sn–6.5Zn alloy; Microstructure; Mechanical properties
Wettability of SnCuNi-xEu solders and mechanical properties of solder joints
Keywords: لحیم کاری بدون سرب; lead-free solders; wetting; mechanical property; fracture morphology; rare earths
Pb-free solders: Experimental and calculated enthalpy of mixing of the liquid Au–In–Sn–Zn quaternary system
Keywords: لحیم کاری بدون سرب; Enthalpy of mixing; Partial enthalpy; Lead-free solders; Au–In–Sn–Zn
Theoretical prediction of thermodynamic activities of all components in the Bi-Sb-Sn ternary lead-free solder system and Pb-Bi-Sb-Sn quaternary system
Keywords: لحیم کاری بدون سرب; Lead-free solders; Bi-Sb-Sn; Pb-Bi-Sb-Sn; MIVM; Activity; Alloy
Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5Zn alloy
Keywords: لحیم کاری بدون سرب; Lead-free solders; Sn–Zn alloys; Microstructure; Mechanical properties
Electrodeposition of Sn-Zn-Cu alloys from citrate solutions
Keywords: لحیم کاری بدون سرب; electrodeposition; Sn-Zn-Cu alloys; lead-free solders
Nanomechanical characterization of Sn-Ag-Cu/Cu joints-Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature
Keywords: لحیم کاری بدون سرب; Lead-free solders; Intermetallics; High-temperature nanoindentation; Reliability; Aerospace applications;
Nanomechanical characterization of Sn-Ag-Cu/Cu joints-Part 1: Young's modulus, hardness and deformation mechanisms as a function of temperature
Keywords: لحیم کاری بدون سرب; Lead-free solders; Intermetallics; High-temperature nanoindentation; Reliability; Aerospace applications;
Microstructure-based modeling of the ageing effect on the deformation behavior of the eutectic micro-constituent in SnAgCu lead-free solder
Keywords: لحیم کاری بدون سرب; Lead-free solders; Micromechanical modeling; Finite-element simulation; Tomography; Intermetallic compounds;
Effective suppression of electromigration-induced Cu dissolution by using Ag as a barrier layer in lead-free solder joints
Keywords: لحیم کاری بدون سرب; Electromigration; Cu dissolution; Lead-free solders; Barrier layer
Investigation of microstructure and mechanical properties of novel Sn–0.5Ag–0.7Cu solders containing small amount of Ni
Keywords: لحیم کاری بدون سرب; Lead-free solders; Microstructure; Intermetallic compound; Tensile; Hardness
Thermodynamic properties of liquid Au-Bi-Sn alloys
Keywords: لحیم کاری بدون سرب; Lead-free solders; Au-Bi-Sn alloys; Activity; Thermodynamic properties; Electromotive force (EMF);
Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions
Keywords: لحیم کاری بدون سرب; Lead-free solders; Microstructure; Intermetallic compound; Creep
Lead-free solder alloys: Thermodynamic properties of the (Au + Sb + Sn) and the (Au + Sb) system
Keywords: لحیم کاری بدون سرب; Lead-free solders; Au-Sb-Sn alloys; Activity; Thermodynamic properties; Electromotive force (EMF);
Experimental investigation and thermodynamic prediction of the Au–Cu–Sb phase diagram
Keywords: لحیم کاری بدون سرب; Au–Cu–Sb phase diagram; Thermodynamic prediction; Lead-free solders
Lead-free soldering: Investigation of the Cu-Sn-Sb system along the Sn:Sb = 1:1 isopleth
Keywords: لحیم کاری بدون سرب; Lead-free solders; Differential scanning calorimetry; Cu-Sn-Sb; Phase diagram;
Mechanical properties of Pb-free SnAg solder joints
Keywords: لحیم کاری بدون سرب; Soldering; Lead-free solders; Plastic deformation; Transmission electron microscopy (TEM); Intermetallic compounds
Effect of additives on the co-electrodeposition of Sn–Ag–Cu lead-free solder composition
Keywords: لحیم کاری بدون سرب; Lead-free solders; Solder bumping; Sn–Ag–Cu; Ternary bath; Additives
Enthalpies of mixing of liquid In–Sn and In–Sn–Zn alloys
Keywords: لحیم کاری بدون سرب; Enthalpy of mixing; Lead-free solders; Liquid alloys; Calorimetry; In–Sn; In–Sn–Zn
Nanoindentation measurements and mechanical testing of as-soldered and aged Sn–0.7Cu lead-free miniature joints
Keywords: لحیم کاری بدون سرب; Nanoindentation; Lead-free solders; Intermetallic compounds; Mechanical properties; Strain-rate sensitivity
The determination of the integral enthalpies of mixing of liquid Au–In–Sn alloys and the enthalpy of formation of the Au4In3Sn3 compound
Keywords: لحیم کاری بدون سرب; High temperature calorimetry; Alloy thermochemistry; Enthalpy of formation; Enthalpy of mixing; Lead-free solders
The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures
Keywords: لحیم کاری بدون سرب; Lead-free solders; Sn–Ag–Cu; Mechanical property; Microstructure; Strain rate
Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
Keywords: لحیم کاری بدون سرب; Lead-free solders; Intermetallic compound layers; Thermodynamics; Phase diagrams; Diffusion kinetics; Alloying elements;
The effects of temperature and solders on the wettability between ribbon and solar cell
Keywords: لحیم کاری بدون سرب; Lead-free solders; Contact angle measurement; Dewetting
Effect of indium on wettability of Sn–Ag–Cu solders. Experiment vs. modeling, Part I
Keywords: لحیم کاری بدون سرب; Lead-free solders; Wettability; In additions; Sn–Ag and Sn–Ag–Cu eutectics
Effect of indium on the microstructure of the interface between Sn3.13Ag0.74CuIn solder and Cu substrate
Keywords: لحیم کاری بدون سرب; Lead-free solders; Copper; Interaction; X-ray scan; Phase analysis
Thermodynamic modelling and assessment of the Au–In–Sn system
Keywords: لحیم کاری بدون سرب; Calphad; Lead-free solders; Au–In–Sn; Thermodynamics; Alloys
Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates
Keywords: لحیم کاری بدون سرب; Wetting; Lead-free solders; Reactivity; Interface; Intermetallics
Corrosion behaviour assessment of lead-free Sn–Ag–M (M = In, Bi, Cu) solder alloys
Keywords: لحیم کاری بدون سرب; Lead-free solders; Tin-based alloys; Corrosion behaviour; Polarization curves
Surface tension and wetting behaviour of molten Cu–Sn alloys
Keywords: لحیم کاری بدون سرب; Surface tension; Wetting; Lead-free solders
Theoretical and experimental investigations of microstructural changes in lead-free solders
Keywords: لحیم کاری بدون سرب; 81.40.Gh; 72.15.âv; 66.30.âh; 64.75.+g; 68.03.Cd; Lead-free solders; Diffusion; Spinodal decomposition; Coarsening;
Enthalpies of mixing of liquid Bi–Cu and Bi–Cu–Sn alloys relevant for lead-free soldering
Keywords: لحیم کاری بدون سرب; Lead-free solders; Enthalpy of mixing; Liquid alloys; Calorimetry; Bi–Cu; Bi–Cu–Sn
The effect of crosshead speed on the joint strength between Sn-Zn-Bi lead-free solders and Cu substrate
Keywords: لحیم کاری بدون سرب; Lead-free solders; Intermetallic; Sn-Zn based solders; Tensile test
The surface tension and density of the Cu-Ag-In alloys
Keywords: لحیم کاری بدون سرب; Cu-Ag-In alloys; Density; Surface tension; Lead-free solders;