Formation, processing and characterization of Co-Sn intermetallic compounds for potential integration in 3D interconnects

Formation, processing and characterization of Co-Sn intermetallic compounds for potential integration in 3D interconnects

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 140, 1 June 2015, Pages 72-80

George Vakanas, O. Minho, Biljana Dimcic, Kris Vanstreels, Bjorn Vandecasteele, Inge De Preter, Jaber Derakhshandeh, Kenneth Rebibis, Masanori Kajihara, Ingrid De Wolf, Eric Beyne,