Solid-state interfacial reactions of Sn and Sn-Ag-Cu solders with an electroless Co(P) layer deposited on a Cu substrate

Solid-state interfacial reactions of Sn and Sn-Ag-Cu solders with an electroless Co(P) layer deposited on a Cu substrate

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 662, 25 March 2016, Pages 475-483

Chao-hong Wang, Chun-chieh Wen, Che-yang Lin,