Keywords: مانع نفوذ; Plasma coating; Silver release; Diffusion barrier; Functional fibers; Electrical properties;
مقالات ISI مانع نفوذ (ترجمه نشده)
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Keywords: مانع نفوذ; Co-sputtering deposition; Multilayers; Self-assembly; Diffusion barrier;
Keywords: مانع نفوذ; Valve; Microfluidics; Magnetic; Microcapsule; Diffusion barrier; Flow rectification;
Keywords: مانع نفوذ; Cu-Mn alloy; Deep eutectic solvent; Pulse electrodeposition; Diffusion barrier;
Keywords: مانع نفوذ; Amorphous metal alloy; Metal-metal nitride alloy; CoTiN; Atomic layer deposition; Interlayer formation; Diffusion barrier;
Keywords: مانع نفوذ; Graphene; Density functional theory; Molecular dynamics; Gas separation; Diffusion barrier;
Keywords: مانع نفوذ; Defective silicene; Adsorption energy; AIMD simulation; Diffusion barrier;
Keywords: مانع نفوذ; IGBT; Robustness validation; Temperature stability; Copper-silicide; Diffusion barrier; Wire bonding; Die attach;
Keywords: مانع نفوذ; Borophene; Specific capacity; Diffusion barrier; Lithium-ion batteries; First-principles calculations; Ab-initio molecular dynamics simulations;
Keywords: مانع نفوذ; Graphene; Solid phase reaction; Diffusion barrier
Keywords: مانع نفوذ; Diffusion barrier; Thermoelectric; Bismuth telluride; Cobalt; Nickel
Keywords: مانع نفوذ; Oxyfluoride glass-ceramics; Diffusion barrier; Nano crystals; Phase separation
Keywords: مانع نفوذ; Tungsten; Carbide; Annealing; Deuterium retention; Diffusion barrier;
Keywords: مانع نفوذ; Enamel; Structured reactors; Metallic micromonolith; Diffusion barrier; PROX
Keywords: مانع نفوذ; Porous graphene; 1D line defect; All-hydrogen passivated pore; Diffusion barrier; Gas separation; First-principles calculations;
Keywords: مانع نفوذ; Copper; Alloy; Diffusion barrier; Self-forming; Annealing
Keywords: مانع نفوذ; Cu(Cr) alloy film; Diffusion barrier; Thermal stability; Self-forming; Annealing
High temperature behavior of a diffusion barrier coating evolved from ZrO2 precursor layer
Keywords: مانع نفوذ; Ni-based superalloy; ZrO2; Diffusion barrier; Interdiffusion;
Thermal stability of AlCrTaTiZrMo-nitride high entropy film as a diffusion barrier for Cu metallization
Keywords: مانع نفوذ; High-entropy alloy; Diffusion barrier; Thermal stability; Amorphous structure;
Co and CoTix for contact plug and barrier layer in integrated circuits
Keywords: مانع نفوذ; Contact plug; Diffusion barrier; Cobalt; Metal-oxide-semiconductor (MOS);
Relation between modulation frequency of electric power oscillation during pulse magnetron sputtering deposition of MoNx thin films
Keywords: مانع نفوذ; Modulated pulse magnetron sputtering; Molybdenum nitride; Cu-wired MOSFET structures; Diffusion barrier; Plasma&films characterization;
Promotional effect of Al2O3 on WO3/CeO2-ZrO2 monolithic catalyst for selective catalytic reduction of nitrogen oxides with ammonia after hydrothermal aging treatment
Keywords: مانع نفوذ; Selective catalytic reduction; Nitrogen oxides; Hydrothermal stability; Diffusion barrier; Al2O3; Cerium zirconium mixed oxides;
Effects of irradiation on the interface between U-Mo and zirconium diffusion barrier
Keywords: مانع نفوذ; Monolithic; Diffusion barrier; Zirconium; U-Mo; Nuclear fuel;
In-situ transmission electron microscopy study of thermal stability and carbide formation in amorphous Cu-Mn/C films for interconnect applications
Keywords: مانع نفوذ; Amorphous metal; Cu-Mn alloy; Diffusion barrier; In-situ transmission electron microscopy; Solid phase transition;
Characterization of advanced ALD-based thin film barriers for organic electronics using ToF-SIMS analysis
Keywords: مانع نفوذ; 8-Hydroxyquinoline aluminum; Organic light emitting diode; Device stability; Diffusion barrier; ToF-SIMS; Depth profile;
Diffusion barrier effect of Ta/Ti bilayer in organic dielectric/Cu interconnects
Keywords: مانع نفوذ; Tantalum/Titanium bilayer; Diffusion barrier; Adhesion promoter; Interface-blocking; Copper interconnection;
Electrodeposition of rhenium-base layer as a diffusion barrier between the NiCoCrAlY coating and a Ni-based superalloy
Keywords: مانع نفوذ; Diffusion barrier; Inter-diffusion; Microstructure; Rhenium; NiCoCrAlY;
The effect of the Re-Ni diffusion barrier on the adhesion strength and thermal shock resistance of the NiCoCrAlY coating
Keywords: مانع نفوذ; NiCoCrAlY; Diffusion barrier; Interdiffusion; Adhesion strength; Thermal shock; Oxidation;
Investigation of the barrier properties of copper-vanadium alloys with a sub-tantalum layer on low-k dielectrics
Keywords: مانع نفوذ; Cu interconnect; Diffusion barrier; Cu-V alloy; Ta; Low-k dielectric;
Structural evolution of Zr-Cu-Ni-Al-N thin film metallic glass and its diffusion barrier performance in Cu-Si interconnect at elevated temperature
Keywords: مانع نفوذ; Thin film; Thermal properties; Sputtering; Diffusion barrier; Cu interconnect;
Barrier effect of oxide on Cu permeation on Be surface
Keywords: مانع نفوذ; Beryllium; Diffusion barrier; Adsorption energy; Charge transfer;
Microstructural evolution of germanium modified AlSi-slurry coatings on alloy 600 at 620 °C in metal dusting environment
Keywords: مانع نفوذ; Germanium modified aluminide slurry coatings; Metal dusting; Diffusion barrier;
Diffusion barrier coating using a newly developed blowing coating method for a thermally stable Pd membrane deposited on porous stainless-steel support
Keywords: مانع نفوذ; Hydrogen separation; Pd composite membrane; Diffusion barrier; YSZ; Blowing coating;
A magnetron sputtered microcrystalline β-NiAl coating for SC superalloys. Part II. Effects of a NiCrO diffusion barrier on oxidation behavior at 1100 °C
Keywords: مانع نفوذ; β-NiAl; Oxidation; Secondary reaction zone; Diffusion barrier;
Synergetic effect of Bi2Te3 alloys and electrodeposition of Ni for interfacial reactions at solder/Ni/Bi2Te3 joints
Keywords: مانع نفوذ; Thermoelectric; Electroplating; Surface modification; Microstructure; Diffusion barrier;
Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects
Keywords: مانع نفوذ; Zn-5Al solder; Electroless Ni-W-P coating; Diffusion barrier; Interfacial reaction; Kirkendall voids;
Simulation study of temperature-dependent diffusion behaviors of Ag/Ag(001) at low substrate temperature
Keywords: مانع نفوذ; Ag/Ag(001); Diffusion barrier; Temperature dependence; Surface roughness; First Principles calculations; Kinetic Monte Carlo simulation;
Solid state synthesis of Mn5Ge3 in Ge/Ag/Mn trilayers: Structural and magnetic studies
Keywords: مانع نفوذ; Long-range atomic transfer; Mn-Ge system; Thin-film solid-state reaction; Diffusion barrier; Dominant diffusing species; First phase; Mn5Ge3 alloy;
Amorphous CoTix as a liner/diffusion barrier material for advanced copper metallization
Keywords: مانع نفوذ; LSI; Interconnection; Diffusion barrier; Amorphous; Co alloy;
Cement hydration from hours to centuries controlled by diffusion through barrier shells of C-S-H
Keywords: مانع نفوذ; Hydration modeling; Aging of concrete; Calcium silicate hydrate; Diffusion barrier; Relative humidity; Effective diffusivity; Cement particle size; Temperature; Water-to-cement ratio;
Transport property improvements of amorphous In-Zn-O transistors with printed Cu contacts via rapid temperature annealing
Keywords: مانع نفوذ; Printed contacts; Copper; Rapid temperature annealing; Indium-zinc-oxide; Semiconductor; Tantalum; Diffusion barrier; Thin-film transistors;
Characterisation of the barrier formation process of self-forming barriers with CuMn, CuTi and CuZr alloys
Keywords: مانع نفوذ; Self-forming barrier; Diffusion barrier; Copper alloy; CuMn; CuTi; CuZr; Manganese; Titanium; Zirconium
Efficiency enhancement of CIGS compound solar cell fabricated using homomorphic thin Cr2O3 diffusion barrier formed on stainless steel substrate
Keywords: مانع نفوذ; Flexible Cu(In,Ga)Se2 (CIGS); Stainless steel; Sputtering; Diffusion barrier; Fe diffusion;
Preparation of ultrathin TiNx films by radical assisted low temperature deposition and their barrier properties against Cu diffusion
Keywords: مانع نفوذ; Cu-through silicon via (TSV); Diffusion barrier; TiN; Low-temperature deposition; Radical reaction; Hot wire;
Densification of gadolinia-doped ceria diffusion barriers for SOECs and IT-SOFCs by a sol–gel process
Keywords: مانع نفوذ; A. Sol–gel process; Diffusion barrier; SOEC; IT-SOFC; Metal alkoxide
Interfacial evolution behavior of AgSbTe2.01/nanosilver/Cu thermoelectric joints
Keywords: مانع نفوذ; Low-temperature joining technique; Nanosilver paste; Thermoelectric material; Aging tests; Diffusion barrier;
Formation of Al2O3 diffusion barrier in cold-sprayed NiCoCrAlY/Ni multi-layered coatings on 304SS substrate
Keywords: مانع نفوذ; In-situ growth; Diffusion barrier; Al2O3; Mechanical alloying; Cold spray; Annealing;
Formation of surface oxides and its effects on the hydrogen permeability of Nb40Ti30Ni30 alloy
Keywords: مانع نفوذ; Hydrogen permeation; Interdiffusion; Oxide layer; Diffusion barrier; Nb–TiNi alloy
Highly-conformal nanocrystalline molybdenum nitride thin films by atomic layer deposition as a diffusion barrier against Cu
Keywords: مانع نفوذ; Molybdenum nitride; Atomic layer deposition; Diffusion barrier; Nanocrystalline; Step coverage
Solid-state interfacial reactions of Sn and Sn-Ag-Cu solders with an electroless Co(P) layer deposited on a Cu substrate
Keywords: مانع نفوذ; Lead-free solders; Electroless deposition; Interfacial reactions; Diffusion barrier;