Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects

Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 722, 25 October 2017, Pages 746-752

Li Liu, Zhiwen Chen, Zhaoxia Zhou, Guang Chen, Fengshun Wu, Changqing Liu,