Design of dual ring wavelength filters for WDM applications

• Dual ring double filters (band pass filter and channel drop filter) on single layout possess passing and dropping band of wavelengths in two distinct arrangements.
• The entire band quality factors of 92.09523 & 505.263 and 124.85019 & 456.8633 are obtained for pass and drop filters of initial set up and amended set up respectively.
• These filters have high quality factor with broad and narrow bandwidths of 16.8 nm & 3.04 nm and 12.85 nm & 3.3927 nm.
• Two dual ring filters incorporated on a single layout comprises the size of 15×11 μm which can also be used in the integrated photonic chips for ultra-compact unification of devices.

Wavelength division multiplexing plays a prime role in an optical communication due to its advantages such as easy network expansion, longer span lengths etc. In this work, photonic crystal based filters with the dual rings are proposed which act as band pass filters (BPF) and channel drop filter (CDF) that has found a massive applications in C and L-bands used for wavelength selection and noise filtering at erbium doped fiber amplifiers and dense wavelength division multiplexing operation. These filters are formulated on the square lattice with crystal rods of silicon material of refractive index 3.4 which are perforated on an air of refractive index 1. Dual ring double filters (band pass filter and channel drop filter) on single layout possess passing and dropping band of wavelengths in two distinct arrangements with entire band quality factors of 92.09523 & 505.263 and 124.85019 & 456.8633 for the pass and drop filters of initial setup and amended setup respectively. These filters have the high-quality factor with broad and narrow bandwidths of 16.8 nm & 3.04 nm and 12.85 nm & 3.3927 nm. Transmission spectra and band gap of the desired filters is analyzed using Optiwave software suite. Two dual ring filters incorporated on a single layout comprises the size of 15×11 μm which can also be used in the integrated photonic chips for the ultra-compact unification of devices.