Automatic optic waveguide chip packaging system based on center-integration algorithm

In order to realize efficient automatic packaging of the waveguide chip and reduce its cost, an integrated optic waveguide chip packaging system based on center-integration algorithms is designed and fabricated, which realizes 11-dimension position adjustment and fewer operation times. The integration center position is obtained through the sampling data. The system can avoid local optimum and reduce packaging time as well as packaging loss. The automated alignment of a single-core fiber with channel waveguide and single-core fiber system is completed in less than 2 min. The packaging experiment of a single-core fiber array with 1 × 8 splitter coupler and 8-core fiber array is completed in less than 5 min with an insert-loss of less than 10.5 dB and homogenization of less than 0.4 dB. The system is validated with good efficiency and practicability.