Enhanced dielectric properties of polypropylene based composite using Bi2S3 nanorod filler

A novel two-phase composite system using polypropylene (PP) as matrix and semiconductor bismuth sulfide (Bi2S3) as filler, was prepared by a simple process. Surfactant KH550 was chosen to modify the interface between inorganic fillers and organic PP matrix. The variations of dielectric properties of the Bi2S3/PP composites with the volume fraction of Bi2S3, frequency and temperature were discussed. The results reveal a percolative behavior of the composites with the threshold of 0.08. The composite is demonstrated to have good dielectric properties. The thermal stability of dielectric property and high breakdown strength of the composites show their potential application in film capacitor.