Microstructural evolution in adiabatic shear bands of copper at high strain rates: Electron backscatter diffraction characterization

The microstructural evolution of adiabatic shear bands in annealed copper with different large strains at high strain rates has been investigated by electron backscatter diffraction. The results show that mechanical twinning can occur with minimal contribution to shear localization under dynamic loading. Elongated ultrafine grains with widths of 100–300 nm are observed during the evolution of the adiabatic shear bands. A rotational dynamic recrystallization mechanism is proposed to explain the formation of the elongated ultrafine grains.

► The microstructural evolution of ASB is studied by electron backscatter diffraction.
► Twinning can occur in ASB while the contribution to shear localization is slight.
► Elongated ultrafine grains are observed during the evolution process of ASB.
► A possible mechanism is proposed to explain the microstructure evolution of ASB.