Microstructure, mechanical properties, electrical conductivity and wear behavior of high volume TiC reinforced Cu-matrix composites

This study deals with the processing, microstructure, mechanical properties, electrical conductivity and wear behavior of high volume titanium carbide reinforced copper matrix composites. The microstructural study revealed that the titanium carbide particles were distributed uniformly in the matrix phase. No interface debonding and micro-cracks were observed in the composite. The addition of alloying elements in the copper considerably increased the sintered density and properties. The composite hardness and strength increased with titanium carbide content and alloying elements in the matrix phase. The electrical conductivities of the composites were predicted using three point upper bound and two phase self consistent predictive models. The wear resistance of the composites was studied against high speed steel. Wear mechanisms were discussed by means of microscope observations on the worn surfaces. The ratio of titanium carbide average grain size to the mean free path of the binder was introduced as a parameter to determine wear performance.