کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1573570 | 1514687 | 2016 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
A new strategy to simultaneous increase in the strength and ductility of AA2024 alloy via accumulative roll bonding (ARB)
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: A new strategy to simultaneous increase in the strength and ductility of AA2024 alloy via accumulative roll bonding (ARB) A new strategy to simultaneous increase in the strength and ductility of AA2024 alloy via accumulative roll bonding (ARB)](/preview/png/1573570.png)
چکیده انگلیسی
Nano/ultrafine grained (NG/UFG) AA2024 alloy produced by accumulative roll bonding (ARB) showed high strength (420 MPa) and very limited elongation (about 1.3%). A new strategy via ARB was developed to improve elongation (about 10%) of AA2024 alloy with a relatively high strength (365 MPa). The present strategy produced a bimodal structure consisting of coarse and ultrafine elongated grains in comparison to the UFG alloy. Electron backscattered diffraction (EBSD) revealed that after 4 ARB cycles, the fraction of high angle grain boundaries and mean misorientation angle of the boundaries in the bimodal grain structure were 61% and 27.34°, respectively, in comparison to that of annealed (54% and 24.96°) and UFG (79% and 34.27°) alloy. The crystallographic texture results indicated that, unlike the annealed AA2024 alloy, the intensity of Brass {011}<211> and S {123}<634> components remarkably increased in the UFG and bimodal alloy. Scanning electron microscopy (SEM) observations demonstrated that failure mode in bimodal alloy was ductile fracture with a combination of deep and shallow dimples.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 656, 22 February 2016, Pages 12-20
Journal: Materials Science and Engineering: A - Volume 656, 22 February 2016, Pages 12-20
نویسندگان
M. Naseri, M. Reihanian, E. Borhani,