کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1575100 | 1514735 | 2014 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn-Ag-Cu lead-free solders
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn-Ag-Cu lead-free solders Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn-Ag-Cu lead-free solders](/preview/png/1575100.png)
چکیده انگلیسی
The effects of Zn addition on the microstructure, thermal behavior and tensile creep properties of Sn-1.0Ag-0.3Cu (SAC103) alloy were systematically investigated. Differential scanning calorimetry (DSC) reveals that the reductions of undercooling and pasty range are more significant for Zn-containing solders, although the solidus temperature remains the same or slightly changed. The creep life time of plain SAC103 alloy was remarkably enhanced two times with the addition of 3 wt% Zn. Moreover, significant improvement in creep resistance of 145% and 360% is realized with the addition of 2 wt% and 3 wt% Zn into SAC(103) solder, respectively. The improvement of creep behavior is due to the microstructural change of Zn-containing solders, since the formation of new (Cu,Ag)5Zn8 intermetallic compound (IMC) phase and fine fiber-like Ag3Sn precipitates at the surface of β-Sn matrix could provide more obstacles for dislocation pile-up, which enhanced the stress exponent values and improved the creep resistance and creep life time. These results show that the Garofalo model is suitable for describing the steady-state creep behavior of SAC(103) solders over the tested stress and temperature ranges.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 608, 1 July 2014, Pages 130-138
Journal: Materials Science and Engineering: A - Volume 608, 1 July 2014, Pages 130-138
نویسندگان
A.A. El-Daly, A.E. Hammad, G.S. Al-Ganainy, M. Ragab,