کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1576844 | 1514786 | 2012 | 14 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Effect of hot rolling temperature and thermal cycling on creep and damage behavior of powder metallurgy processed Al-SiC particulate composite
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Effect of hot rolling temperature and thermal cycling on creep and damage behavior of powder metallurgy processed Al-SiC particulate composite Effect of hot rolling temperature and thermal cycling on creep and damage behavior of powder metallurgy processed Al-SiC particulate composite](/preview/png/1576844.png)
چکیده انگلیسی
Tensile creep behavior of Al-5SiCp composite, powder metallurgy processed and hot-rolled at either 400 °C (400-HRC) or 600 °C (600-HRC), has been examined. Creep-tests have been carried out at temperature and stress ranges of 325-400 °C and 9-21 MPa, respectively. The creep behavior has been examined by analyzing steady-state creep rate, time to rupture, Larson-Miller parameter (LMP), strain fractions in primary, secondary and tertiary stages, with assessment of damage and dimple size. The creep resistance of 400-HRC with higher dislocation density is found as greater than that of 600-HRC, whereas apparent stress exponents and activation energies exceed that for dislocation climb. The results suggest possibility of life prediction using Monkman-Grant relationship and LMP variation with stress. Thermal cycling between 500 °C and 0 °C is more effective in improving creep resistance at lower temperatures, and is more beneficial for 400-HRC than for 600-HRC, confirming positive role of strain-hardening.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 557, 15 November 2012, Pages 92-105
Journal: Materials Science and Engineering: A - Volume 557, 15 November 2012, Pages 92-105
نویسندگان
Jishnu J. Bhattacharyya, R. Mitra,