کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1577714 | 1514805 | 2012 | 7 صفحه PDF | دانلود رایگان |

Employing reactive synthesis and consolidation and using elemental powders as reactants, TiC/Ni cermets were formed and bonded to Ti substrates in one step by a field-activated method. Microstructural observations and EDS analyses revealed well-formed, crack-free bonds between the layers. Bonding between the TiC/Ni cermet and the Ti substrate was facilitated by the formation of TiAl as an intermediate layer, which also formed from the elements during the on-step process.Shear strength and thermal shock evaluations were made on the resulting samples. The diffusion-bonded interface has a shear resistance of as high as 70.98 MPa and has a good thermal shock resistance. Crack propagation observations indicate high interface strength. The interface between Ti and TiAl has a higher bonding strength than that between the TiC/Ni cermet and TiAl.
► An advanced bonding of cermet to metal was carried out by PAPAS process.
► In situ synthesis of TiC/Ni and bonding to Ti were accomplished in one step.
► TiAl was used as intermediate layer of bonding.
► Heat produced by the formation of TiAl from element powder was the key of bonding.
► The diffusion-bonded interface has higher shear and thermal shock resistance.
Journal: Materials Science and Engineering: A - Volume 538, 15 March 2012, Pages 103–109