Influence of microstructure on quasi-static and dynamic mechanical properties of bismuth-containing lead-free solder alloys

► Tensile and dynamic properties of lead-free solder were evaluated. ► Emphasis on addition of bismuth to alloys and role of isothermal aging. ► Addition of bismuth increases strength. ► Strength maintained in Bi-containing alloy after aging, which is opposite of SAC305. ► Unlike SAC305 damping capacity of Bi-containing changes with aging like SnPb and Sn.