Tensile creep testing of an Al-Cu alloy above solidus with a dynamic mechanical analyser

► Creep behavior above solidus of an Al-alloy was investigated using a DMA. ► Measurement of creep modulus (≈elastic) above solidus was done with good accuracy. ► The influence of grain morphology on the modulus with 8-9% liquid was revealed. ► With ∼8% liquid, failure or not depended that the applied stress was 0.5 or 1 MPa. ► Liquation of coalesced grain boundaries was revealed upon reheating.