کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1579073 1514828 2010 10 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Numerical simulations of void growth in aluminum alloy AA5083 during elevated temperature deformation
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله
Numerical simulations of void growth in aluminum alloy AA5083 during elevated temperature deformation
چکیده انگلیسی

Finite element computations are used to simulate void growth during elevated temperature deformation of polycrystalline aluminum alloy AA5083. The model accounts rigorously for the coupling between dislocation creep, grain boundary diffusion and grain boundary sliding; and considers a realistic 2D grain structure. The simulations are used to predict the influence of loading conditions, material properties and microstructure on void growth rates. The predictions are shown to be in good agreement with experimental observations of cavitation in aluminum. In addition, the simulations show that the rate of void growth is strongly sensitive to the detailed grain structure near the void. Consequently, the void growth rates in a realistic microstructure differ substantially from the predictions of models that idealize the grain structure as a periodic array.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 527, Issues 18–19, 15 July 2010, Pages 4837–4846
نویسندگان
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