Microcreep of rapidly solidified Sn–0.7 wt.% Cu–In solder alloys

Sn–Cu eutectic alloy rapidly solidified has excellent mechanical and electrical properties, which makes it a suitable candidate for replacement of Pb–Sn solder, however it needs more study. In this paper, we study the effect of indium additions on the properties of Sn–Cu eutectic alloy. In addition, we use the new technique, which has been developed by [Tarek El-Ashram, R.M. Shalaby, J. Electron. Mater., 34 (2005) 212–215.] to study the creep behavior of Sn–Cu–In alloys. The results showed that the hardness of Sn–Cu eutectic alloy was increased due to the addition of indium, however, the creep resistance was decreased, also Young's modulus was decreased and the resistivity was increased.