Effect of laser input energy on AuSnx intermetallic compounds formation in solder joints with different thickness of Au surface finish on pads

Formation of AuSnx intermetallic compounds (IMCs) in laser reflowed solder joints was investigated. The results showed that few IMCs formed at the solder/0.1 μm Au interface. Needlelike AuSn4 IMCs were observed at the solder/0.5 μm Au interface. In Sn-2.0Ag-0.75Cu-3.0Bi and Sn-3.5Ag-0.75Cu solder joints, when the laser input energy was increased, AuSn4 IMCs changed from a layer to needlelike or dendritic distribution at the solder/0.9 μm Au interface. As for the solder joints with 4.0 μm thickness of Au surface finish on pads, AuSn4, AuSn2, AuSn IMCs, and Au2Sn phases formed at the interface. Moreover, the content of AuSnx IMCs, such as, AuSn4 and AuSn2, which contained high Sn concentration, would become larger as the laser input energy increased. In the Sn-37Pb solder joints with 0.9 μm or 4.0 μm thickness of the Au surface finish on pads, AuSn4 IMCs were in netlike distribution. The interspaces between them were filled with Pb-rich phases.