کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1602376 | 1515905 | 2009 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder joints
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder joints Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder joints](/preview/png/1602376.png)
چکیده انگلیسی
Composite solders were prepared by mechanically dispersing different volumes of nano-sized Ag particles into the Sn-0.7Cu eutectic solder. The effects of Ag particle addition on the microstructure of Sn-0.7Cu solder joints were investigated. Besides, the effects of isothermal aging on the microstructural evolution in the interfacial intermetallic compound (IMC) layer of the Sn-0.7Cu solder and the composite solder reinforced with 1vol% Ag particles were analyzed, respectively. Experimental results indicate that the growth rate of the interfacial IMC layer in the Ag particles reinforced composite solder joint is much lower than that in the Sn-0.7Cu solder joint during isothermal aging. The Ag particles reinforced composite solder joint exhibits much lower layer-growth coefficient for the growth of the IMC layer than the corresponding solder joint.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Minerals, Metallurgy and Materials - Volume 16, Issue 6, December 2009, Pages 677-684
Journal: International Journal of Minerals, Metallurgy and Materials - Volume 16, Issue 6, December 2009, Pages 677-684
نویسندگان
Feng Tai, Fu Guo, Zhi-dong Xia, Yong-ping Lei, Yao-wu Shi,