کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1602377 | 1515905 | 2009 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Electromigration in eutectic SnAg solder reaction couples with various ambient temperatures and current densities
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Electromigration in eutectic SnAg solder reaction couples with various ambient temperatures and current densities Electromigration in eutectic SnAg solder reaction couples with various ambient temperatures and current densities](/preview/png/1602377.png)
چکیده انگلیسی
The electromigration behavior of eutectic SnAg solder reaction couples was studied at various temperature (25 and 120°C) when the current density was held constant at 104 A/cm2 or 5 à 103 A/cm2. Under the current density of 104 A/cm2, scallop type Cu6Sn5 spalls and migrates towards the direction of electron flow at room ambient temperature (25°C), but transforms to layer type Cu3Sn and leaves Kirkendall voids in it at high ambient temperature (120°C). Under the current density of 5 à 103 A/cm2 plus room ambient temperature, no obvious directional migration of metal atoms/ions is found. Instead, the thermal stress induced by mismatch of dissimilar materials causes the formation of superficial valley at both interfaces. However, when the ambient temperature increases to 120°C, the mobility of metal atoms/ions is enhanced, and then the grains rotate due to the anisotropic property of β-Sn.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Minerals, Metallurgy and Materials - Volume 16, Issue 6, December 2009, Pages 685-690
Journal: International Journal of Minerals, Metallurgy and Materials - Volume 16, Issue 6, December 2009, Pages 685-690
نویسندگان
Guang-chen Xu, Fu Guo, Wan-rong Zhu,