کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1635670 | 1516959 | 2015 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Effects of Sn element on microstructure and properties of Zn-Cu-Bi-Sn high-temperature solder
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
The microstructures and properties of the Zn-Cu-Bi-Sn (ZCBS) high-temperature solders with various Sn contents were studied using differential scanning calorimetry (DSC), scanning electron microscopy (SEM) and X-ray diffraction (XRD). The results indicate that the increase of Sn content can both decrease the melting temperature and melting range of ZCBS solders and it can also effectively improve the wettability on Cu substrate. The shear strength of solder joints reaches a maximum value with the Sn addition of 5% (mass fraction), which is attributed to the formation of refined β-Sn and primary É-CuZn5 phases in η-Zn matrix. However, when the content of Sn exceeds 5%, the shear strength decreases due to the formation of coarse β-Sn phase, which is net-shaped presented at the grain boundary.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Transactions of Nonferrous Metals Society of China - Volume 25, Issue 3, March 2015, Pages 879-884
Journal: Transactions of Nonferrous Metals Society of China - Volume 25, Issue 3, March 2015, Pages 879-884
نویسندگان
Fei XING, Xiao-ming QIU, Yang-dong LI,