Electrical performance and reliability evaluation of inkjet-printed Ag interconnections on paper substrates

Printing technology, especially inkjet printing, enables mass manufacturing of electronics on various substrate materials. Paper is one potential carrier for printed electronics to realize low-cost, flexible, recyclable smart packages. However, concerns exist regarding commonly used photo paper substrate, in terms of price and reliability against environmental variation. In this work, for the first time, ordinary low-cost and high-moisture-resistance package paper is investigated as an alternative to be the substrate of printed electronics. The surface morphology and electrical performance of inkjet printed interconnections on six different paper substrates from two categories (inkjet paper and package paper) are examined and compared. The printed interconnections on inkjet papers show smaller sheet resistance and better repeatability than those on package papers. However, low-cost package paper stands higher temperature and exhibits better reliability during 85 °C/85% RH aging test. Package paper is suitable for smart package applications that have relaxed requirements of conductivity and high requests of moisture resistance.

► We investigate the suitability of utilizing package paper as the substrate for printed electronics.
► The surface morphology and electrical performance of inkjet printed interconnections on inkjet papers and package papers are examined and compared.
► The reliability of inkjet printed interconnections on paper substrates is evaluated by 85 °C/85% RH aging test.
► The printed interconnections on inkjet papers show smaller sheet resistance and better repeatability than those on package papers.
► Low-cost UV-coated package paper stands higher temperature and exhibits better reliability against environmental variation. UV package paper is suitable for smart package applications that have relaxed requirements of conductivity and high requests of moisture resistance.