Microstructural characterization of electrically failed conductive traces printed from Ag nanoparticle inks

Conductive traces printed from nanoparticle loaded silver inks failed due to the application of excessive electrical current. A non-homogeneous microstructure was observed in the vicinity of the failed region consisting of sintered particles, grains and melted particles indicating a significant amount of heat was transferred to the conductive trace, in some cases, resulting in substrate damage. A simple physical model describing the failure mechanisms is proposed.

► We characterize the electrical failure of nanoparticle ink-printed conductive traces.
► We document a variety of microstructures in close proximity to one another.
► The microstructures include grains, sintered and unsintered nanoparticles.
► We describe a model explaining the physical failure mechanisms.
► The model is based on the magnitude of applied stress due to the microstructures.