Ultrafine grained copper alloy sheets having both high strength and high electric conductivity

The ultrafine grained (UFG) microstructure, mechanical properties and electric conductivity of the Cu alloys severely deformed by accumulative roll bonding (ARB) process were systematically investigated. High density of grain boundaries introduced by the ARB process has significant effect on strengthening but little effect on the electric conductivity. The UFG Cu alloys with submicometer grain sizes can achieve both superior mechanical properties and high electric conductivity.