کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1649601 1007586 2009 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Growth orientation of the tin whiskers on an electrodeposited Sn thin film under three-point bending
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
Growth orientation of the tin whiskers on an electrodeposited Sn thin film under three-point bending
چکیده انگلیسی
To release the compressive stress in an as-electrodeposited tin (Sn) layer, filamentary Sn whiskers were formed on the layer aged at room temperature. A three-point bending test was performed on an electrodeposited Sn layer to investigate the Sn whisker growth under mechanically applied tensile stress. Sn whisker growth was mitigated on the Sn layer subjected to a tensile stress in bending. The growth orientation of the Sn whiskers formed on the high tensile stress region was random but directional on the low tensile stress region.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Letters - Volume 63, Issue 17, 15 July 2009, Pages 1517-1520
نویسندگان
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