کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1652181 | 1007637 | 2007 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Preparation of ultra-fine copper powder and its lead-free conductive thick film
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Preparation of ultra-fine copper powder and its lead-free conductive thick film Preparation of ultra-fine copper powder and its lead-free conductive thick film](/preview/png/1652181.png)
چکیده انگلیسی
In this paper, non-agglomerated monodispersed ultra-fine copper metallic powders have been synthesized with chemical reduction method. Fine lead-free glass powders were also prepared by solid synthesis process. Thick film paste prepared by above-mentioned copper metallic powders and lead-free glass powders was applied as conductive paste of MLCC. Mixture of glass and zinc oxide give the thick film a high adhesion strength which is attributed to the rough interface from interfacial reaction between glass and chip, and a good densification. Diffusion of metal between copper thick film and nickel thick film is clear. Ni–Cu solid solution appears under high temperature firing.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Letters - Volume 61, Issue 16, June 2007, Pages 3526–3530
Journal: Materials Letters - Volume 61, Issue 16, June 2007, Pages 3526–3530
نویسندگان
Songping Wu,