Mechanical properties of Cu/SiCp composites fabricated by composite electroforming

The silicon carbide particles (SiCp) dispersion-strengthened copper matrix composites (Cu/SiCp) were fabricated by composite electroforming technology. The microstructure, tensile property and wear behavior of Cu/SiCp composites were investigated. The results showed that composites with different SiCp contents were obtained. The microstructure of the composite presented a uniform distribution of SiCp in the matrix and good interfacial integrity. The hardness, yield strength and rigidity of the composites increased with increasing SiCp content, but at the cost of ductility. Increasing SiCp content in the composite was not always beneficial to the ultimate tensile strength and wear resistance. The ultimate tensile strength increased with SiCp content increasing up to 16 vol.% and decreased as exceeding 16 vol.%, and the wear mass loss decreased with SiCp content increasing up to 21 vol.% and increased again as exceeding 21 vol.%.