Microindentation studies of Hg0.7Cd0.3Te/CdTe compound semiconductor alloy

Vicker's microindentation tests have been carried out on Hg0.7Cd0.3Te compound semiconductor alloys deposited on CdTe substrate. The detailed mechanical properties of this compound were determined from the indentation experiments. Microindentation studies of Hg0.7Cd0.3Te/CdTe show that the hardness value increases with load and attains a constant for further increase in load and the microhardness value was found to lie between 0.32 and 0.47 GPa. The Hg0.7Cd0.3Te response to microindentation was found to be purely plastic behavior and the material was found to be very soft. After indentation the samples were etched in order to delineate the dislocation etch pits around the indentation region. Crack-free surface at the vicinity of the indentation mark has been observed for Hg0.7Cd0.3Te on subsequent etching for 100 g applied load demonstrating the softness of the material behavior.