Laser etching of aluminum thin film on polyimide: Simulation and experimental studies

• Laser induced ablation process of aluminum thin film on polyimide was simulated.
• Etching morphology of film with different laser power was achieved theoretically.
• Theoretical results exhibit good agreement with SEM observed experimental ones.
• The simulation results can be used for optimization of laser etching parameters.
• Presumed laser etching mechanism of aluminum thin film was verified.

Laser etching process of aluminum thin film on polyimide substrate was simulated by the finite element analysis software ANSYS to study the etching results. Theoretical etching profiles of aluminum thin film with different laser parameters were obtained from the simulation, which is in good agreement with experimental results observed by SEM, it shows that a best etching result can be obtained and it corresponded to a set of reasonable parameters. By optimizing such laser etching parameters as laser power and beam scanning velocity, etc., aluminum thin film could be etched ideally without damaging the polyimide substrate. Therefore, the simulation results can be taken as a guide for determination of practical laser etching parameters in order to obtain ideal etching patterns.