Upscaling plasma deposition: The influence of technological parameters

• A basic guide to upscaling of low-pressure plasma processes is presented.
• The selected upscaling constants are related to the technological parameters.
• The discussion shows examples of a-C:H film deposition in an industrial plant.

The technological parameters that control plasma processes follow several scaling rules. Hence, we must adapt inlet gas flow rate, pressure, input power and excitation frequency to the new reactor dimensions. High rates of film deposition or etching; plasma homogeneity, and reproducibility are the main objectives in any attempt to upscaling. This paper provides guidelines to transfer plasma deposition processes from small pilot reactors to large plants for industrial production.