Progress in direct-current plasma immersion ion implantation and recent applications of plasma immersion ion implantation and deposition

Plasma immersion ion implantation and deposition (PIII&D) has been used extensively in microelectronics and metallurgical engineering and its future in biomedical engineering and nanotechnology is even brighter with many novel and burgeoning applications. In this invited review, recent work conducted in the Plasma Laboratory at City University of Hong Kong is described. Advances in direct-current plasma immersion ion implantation, especially non-contact printing and implantation into 3-dimensional components, are discussed. Examples of new applications include fabrication and biological properties of plasma-modified titanium-based materials and control of the surface degradation rate and other properties of biodegradable polymeric and metallic materials.

► Recent work conducted in the Plasma Laboratory at City University of Hong Kong is reviewed.
► Advances in DC-PIII, especially non-contact printing and 3-D DC-PIII, are discussed.
► Fabrication and biological properties of plasma-modified Ti-based materials are presented.
► Control of surface degradation on biodegradable polymeric and metallic materials is described.