کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1658072 1517652 2013 8 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Nitriding Kinetics of Inconel 600
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
Nitriding Kinetics of Inconel 600
چکیده انگلیسی


• Nitriding kinetics of Inconel 600 studied between 450 and 600 °C.
• Plasma nitriding of Inconel 600 results in internal nitrided zone of Cr-depleted γ + CrN.
• Nitride layer thickness in Inconel 600 is comparatively smaller than in steels nitrided under identical conditions.

Ni-based alloys are preferred as structural materials over austenitic stainless steels in nitrogen containing atmospheres like in neutron detectors due to severe problem of nitriding of stainless steels and subsequent loss of nitrogen. Extensive work has been carried out in literature on the nitriding behavior of austenitic stainless steels whereas similar information on Ni-based alloys is very few. Hence, to assess the nitriding kinetics of a Ni-based alloy (Inconel 600) nitriding experiments were carried out. Inconel 600 was plasma nitrided at temperatures in the range of 450–600 °C for time durations of 1 to 24 h. Evolution of the microstructure and kinetics of nitrided layer formation and its growth were investigated using various experimental techniques like electron probe micro-analysis and electron microscopy. Nitriding at a temperature of 600 °C for 24 h resulted in the formation of a nitrided zone of ~ 14 μm thickness. Inconel 600 was found to get internally nitrided resulting in the formation of nano-meter sized fcc CrN precipitates in Cr depleted Ni–Fe based matrix phase. Diffusion coefficient and activation energy values for the diffusion of nitrogen in fcc Ni-based matrix were evaluated using the studies on kinetics of growth of nitrided layer. These values were compared with the available information in literature on other Ni–Cr–Fe alloys.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Surface and Coatings Technology - Volume 226, 15 July 2013, Pages 92–99
نویسندگان
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