Optimization of sputtering parameters for Ni-Cr alloy deposition on copper foil as embedded thin film resistor

►High-quality Ni-Cr alloy sputtered on copper foil was made and investigated. ►Taguchi method was applied in the selection of the optimal deposition conditions. ►A high resistivity of 6.69 × 10− 4 Ω.cm was achieved. ►A low temperature coefficient of resistance of 374.78 ppm/K was attainted. ►A feasible way was introduced to fabricate Ni-Cr alloy as ETFR materials.