کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1659298 | 1517682 | 2010 | 5 صفحه PDF | دانلود رایگان |
![عکس صفحه اول مقاله: High power impulse magnetron sputtering and related discharges: Scalable plasma sources for plasma-based ion implantation and deposition High power impulse magnetron sputtering and related discharges: Scalable plasma sources for plasma-based ion implantation and deposition](/preview/png/1659298.png)
High power impulse magnetron sputtering (HIPIMS) and related self-sputtering techniques are reviewed from a viewpoint of plasma-based ion implantation and deposition (PBII&D). HIPIMS combines the classical, scalable sputtering technology with pulsed power, which is an elegant way of ionizing the sputtered atoms. Related approaches, such as sustained self-sputtering, are also considered. The resulting intense flux of ions to the substrate consists of a mixture of metal and gas ions when using a process gas, or of metal ions only when using ‘gasless’ or pure self-sputtering. In many respects, processing with HIPIMS plasmas is similar to processing with filtered cathodic arc plasmas, though the former is easier to scale to large areas. Both ion implantation and etching (high bias voltage and without deposition) and thin film deposition (low bias, or bias of low duty cycle) have been demonstrated.
Journal: Surface and Coatings Technology - Volume 204, Issues 18–19, 25 June 2010, Pages 2864–2868