Study on high-temperature oxidation behaviors of Cr–Si–N films

The high-temperature oxidation behavior of CrN and Cr–Si–N films was investigated. These films were deposited on STS 304 substrates by a hybrid deposition system with arc ion plating (AIP) and DC magnetron sputtering method using separate Cr (99.99%) and Si (99.99%) targets in a gaseous mixture of Ar and N2. Good oxidation resistance of the CrN film was further improved by the incorporation of Si into the CrN film. The oxidation products of the Cr–Si–N film were Cr2O3 and amorphous SiO2, which were gradually formed by the outward diffusion of Cr, Si, and N as well as the inward diffusion of oxygen. The oxidation kinetics of the specimen showed parabolic behavior, indicating that the diffusion process prevailed during oxidation. The oxidation activation energies for CrN, CrSi0.10N, and CrSi0.15N coatings are 303.8, 316.4, and 333.9 kJ/mol, respectively.