Characterization of cemented Cu matrix composites reinforced with SiC

In this study, some properties of copper produced by cementation method and its composites reinforced with 1wt%, 2wt%, 3wt% and 5wt% SiC particles, produced by powder metallurgy method, were investigated. Composite powders were pressed by applying an uniaxial pressure of 280 MPa and sintered at temperatures of 700 °C for 2 h embedding in graphite powder. Scanning electron microscope (SEM-EDS), X-ray diffraction (XRD) techniques were used to characterize the Cu and SiC which are dominant components in the sintered composites. Microstructure studies revealed that SiC particles were located around the copper particles. The relative densities of Cu-SiC composites determined by Archimedes’ principle decreased from 98.11% to 90.93% with increasing reinforcement components. Measured hardness of sintered compacts varied from 127 to155 HVN. Maximum electrical conductivity of test materials ranged from 80.17% IACS to 57.76% IACS.