کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1691438 | 1011314 | 2008 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Measurement of electromigration-induced stress in aluminum alloy interconnection
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سطوح، پوششها و فیلمها
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چکیده انگلیسی
The behavior of electromigration-induced stress in Al-1.0% Si-0.5% Cu alloy interconnections was investigated in situ by synchrotron radiation at the SPring-8. The electromigration tests were performed as a function of applied current density. When the current was applied to the lines, 111 diffraction peak shifted to lower angle for all measurement points. This indicated that compressive stresses were present at all measurement positions in the lines. When the applied current was stopped, 111 diffraction peak reverted to its initial position for all measurement points. At constant current density, the position of 111 diffraction peak didn't change for any of the measurement positions.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Vacuum - Volume 83, Issue 3, 15 October 2008, Pages 637-640
Journal: Vacuum - Volume 83, Issue 3, 15 October 2008, Pages 637-640
نویسندگان
Kazuya Kusaka, Takao Hanabusa, Shoso Shingubara, Tatsuya Matsue, Osami Sakata,