کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1784223 1524119 2014 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
An infrared thermal image processing framework based on superpixel algorithm to detect cracks on metal surface
ترجمه فارسی عنوان
یک چارچوب پردازش تصویر حرارتی مادون قرمز بر اساس الگوریتم سوپرپیکسل برای تشخیص ترکهای روی سطح فلز
موضوعات مرتبط
مهندسی و علوم پایه فیزیک و نجوم فیزیک اتمی و مولکولی و اپتیک
چکیده انگلیسی


• A proper superpixel algorithm was selected for infrared thermal image processing.
• Proper texture features of superpixels were selected for clustering.
• A new infrared thermal image processing frame was proposed to detect cracks automatically.
• Experiments were implemented to verify the effectiveness of the image processing frame.

Infrared thermography has been used increasingly as an effective non-destructive technique to detect cracks on metal surface. Due to many factors, infrared thermal image has low definition compared to visible image. The contrasts between cracks and sound areas in different thermal image frames of a specimen vary greatly with the recorded time. An accurate detection can only be obtained by glancing over the whole thermal video, which is a laborious work. Moreover, experience of the operator has a great important influence on the accuracy of detection result. In this paper, an infrared thermal image processing framework based on superpixel algorithm is proposed to accomplish crack detection automatically. Two popular superpixel algorithms are compared and one of them is selected to generate superpixels in this application. Combined features of superpixels were selected from both the raw gray level image and the high-pass filtered image. Fuzzy c-means clustering is used to cluster superpixels in order to segment infrared thermal image. Experimental results show that the proposed framework can recognize cracks on metal surface through infrared thermal image automatically.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Infrared Physics & Technology - Volume 67, November 2014, Pages 266–272
نویسندگان
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