Curing temperature- and concentration-dependent dielectric properties of cross-linked poly-4-vinylphenol (PVP)

• We investigate dielectric properties of PVP films cured at 125–200 °C.
• Thickness of PVP is adjusted by varying its concentration from 10 wt% to 2.5 wt%.
• Optimum temperatures are 150 °C for 10 and 7.5 wt% and 175 °C for 5 wt% samples.

In this paper, dielectric properties of various thick PVP films cured at temperatures between 125° C and 200 °C are investigated. The thicknesses of PVP films are adjusted by varying their concentration in PGMEA solvent from 10 wt% to 2.5 wt%. Through FT-IR, C–V, SEM, and AFM analyses, the optimum curing process temperatures (150 °C for 10 wt% and 7.5 wt% samples, and 175 °C for 5 wt% samples) where PET substrates can be thermally endured are proposed in terms of their low hysteresis voltage in the C–V curve (1–2 V in 10 wt% samples, below 1 V in 7.5 wt% samples, and 0.5 V in 5 wt% samples).