کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1787439 | 1023442 | 2007 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Photopatterning of gold and copper surfaces by using self-assembled monolayers
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
فیزیک و نجوم
فیزیک ماده چگال
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Photopatterning of gold and copper surfaces by using self-assembled monolayers Photopatterning of gold and copper surfaces by using self-assembled monolayers](/preview/png/1787439.png)
چکیده انگلیسی
A photolithographic technique was successfully employed to generate micropatterns of gold and copper by using self-assembled monolayer (SAMs) as resist materials. Copper patterns were successfully prepared from SAMs of 11-mercaptoundecanoic acid (MUA) and dodecanethiol (DDT) on Cu after UV irradiation followed by etching but gold patterns were prepared only from the SAM of MUA and not from the SAM of DDT, which revealed the difference of photooxidation of the metal-sulfur bond on SAMs. However, the maximum resolution of the pattern was about 1.0 μm on gold and 5.0 μm on copper. This may be due to lower quality packing of SAM on copper than gold. Ellipsometric and cyclovoltammetric observation of SAMs during the UV irradiation indicated the gradual removal of SAMs on copper and gold. Photopatterning of gold and copper by using SAM is more compatible with the current microelectronics process and is complementary to the microcontact printing technique.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Current Applied Physics - Volume 7, Issue 5, July 2007, Pages 522-527
Journal: Current Applied Physics - Volume 7, Issue 5, July 2007, Pages 522-527
نویسندگان
Hwa-Sup Choi, Yongku Kang, Haiwon Lee, Changjin Lee,