Abnormal residual stress in nanostructured Al thin films grown on Ti/glass substrates

The residual stress and micro-structural properties of nanostructured Al thin films prepared by electron beam evaporator are studied. The films were grown on Ti/glass substrates at normal and oblique angles of inclination. The average aspect ratio of Al nanorods produced at an oblique angle of incidence of 85°, increased from 2.2 to 6.0, as the thickness of the films increased from 100 nm to 600 nm. The column tilt angle of Al nanorods was observed to be in close agreement with the theoretical value. The XRD pattern of nanostructured Al thin films showed (111) planes oriented parallel to the substrate surface. The crystallite size was observed to be ∼9 nm for all the films produced at oblique angle deposition (OAD). Abnormal residual stresses were determined in the films produced at OAD. The nanocrystalline films produced at normal angle, exhibited tensile residual stress, while, the residual stresses in the films produced at oblique angles of inclination (α = 65°, 75°), were observed to be compressive. Residual stress-free nanocolumnar Al films (Al nanorod films) were observed, when they were grown at an oblique angle of inclination of 85°.