کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1832957 | 1027528 | 2006 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Investigation of hybrid pixel detector arrays by synchrotron-radiation imaging
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
فیزیک و نجوم
ابزار دقیق
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Synchrotron-radiation imaging was applied to the non-destructive testing of detector devices during their development cycle. Transmission imaging known as computed laminography was used to examine the microstructure of the interconnections in order to investigate the perfection of technological steps necessary for hybrid detector production. A characterisation of the solder bump microstructure can reveal production flaws such as missing or misaligned bumps, voids in bumps or bridges and thus give valuable information about the bonding process.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment - Volume 563, Issue 1, 1 July 2006, Pages 163–166
Journal: Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment - Volume 563, Issue 1, 1 July 2006, Pages 163–166
نویسندگان
L. Helfen, A. Myagotin, P. Pernot, M. DiMichiel, P. Mikulík, A. Berthold, T. Baumbach,