The effect of bonding layer properties on the dynamic behaviour of surface-bonded piezoelectric sensors

The dynamic behaviour of piezoelectric sensors depends on the bonding condition along the interface between the sensors and the host structure. This paper provides a comprehensive theoretical study of the effect of the bonding layer on the coupled electromechanical characteristics of a piezoelectric sensor bonded to an elastic substrate, which is subjected to a high frequency elastic wave. A sensor model with a viscoelastic bonding layer, which undergoes a shear deformation, is proposed to simulate the two dimensional electromechanical behaviour of the integrated system. Analytical solution of the problem is provided by using Fourier transform and solving the resulting integral equations in terms of the interfacial stress. Numerical simulation is conducted to study the effect of the bonding layer upon the dynamic response of the sensor under different loading frequencies. The results indicate that the modulus and the thickness of the bonding layer have significant effects on sensor response, but the viscosity of the bonding layer is relatively less important.