A novel approach to generate random surface thermal loads in piping

• Approach for generating continuous and time-dependent random thermal fields.
• Temperature fields simulate fluid mixing thermal loads at fluid–wall interface.
• Through plane-wave decomposition, experimental temperature statistics are reproduced.
• Validation of the approach with a case study from literature.
• Random surface thermal loads generation for future thermal fatigue analyses of piping.

There is a need to perform three-dimensional mechanical analyses of pipes, subjected to complex thermo-mechanical loadings such as the ones evolving from turbulent fluid mixing in a T-junction. A novel approach is proposed in this paper for fast and reliable generation of random thermal loads at the pipe surface. The resultant continuous and time-dependent temperature fields simulate the fluid mixing thermal loads at the fluid–wall interface. The approach is based on reproducing discrete fluid temperature statistics, from experimental readings or computational fluid dynamic simulation's results, at interface locations through plane-wave decomposition of temperature fluctuations. The obtained random thermal fields contain large scale instabilities such as cold and hot spots traveling at flow velocities. These low frequency instabilities are believed to be among the major causes of the thermal fatigue in T-junction configurations. The case study found in the literature has been used to demonstrate the generation of random surface thermal loads. The thermal fields generated with the proposed approach are statistically equivalent (within the first two moments) to those from CFD simulations results of similar characteristics. The fields maintain the input data at field locations for a large set of parameters used to generate the thermal loads. This feature will be of great advantage in future sensitivity fatigue analyses of three-dimensional pipe structures.