کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
4971428 | 1450523 | 2017 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
The objective of this study is to quantitatively evaluate the impacts of LED components on the overdriving reliability of high power white LED chip scale packages (CSPs). The reliability tests under room temperature are conducted over 1000Â h in this study on CSP LEDs with overdriving currents. A novel method is proposed to investigate the impact of various components, including blue die, phosphor layer, and substrate, on the lumen depreciation of CSP LEDs after aging test. The electro-optical measurement results show that the overdriving current can lead to both massive light output degradation and significant color shift of CSP LEDs. The quantitative analysis results show that the phosphor layer is the major contributor to the failure in early period aging test. For the long-term reliability, the degradations of phosphor and reflectivity of substrate contribute significantly on lumen depreciation. The proposed reliability assessment method with overdriving loadings can be usefully implemented for LED manufacturers to make a cost- and effective-decision before mass production.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 78, November 2017, Pages 197-204
Journal: Microelectronics Reliability - Volume 78, November 2017, Pages 197-204
نویسندگان
Hongyu Tang, Huaiyu Ye, Cell K.Y. Wong, Stanely Y.Y. Leung, Jiajie Fan, Xianping Chen, Xuejun Fan, Guoqi Zhang,